Production Supervisor, Micro-electronics - 2nd Shift

Anduril Industries is a defense technology company with a mission to transform U.S. and allied military capabilities with advanced technology. By bringing the expertise, technology, and business model of the 21st century’s most innovative companies to the defense industry, Anduril is changing how military systems are designed, built and sold. Anduril’s family of systems is powered by Lattice OS, an AI-powered operating system that turns thousands of data streams into a realtime, 3D command and control center. As the world enters an era of strategic competition, Anduril is committed to bringing cutting-edge autonomy, AI, computer vision, sensor fusion, and networking technology to the military in months, not years. About the Role Join Anduril Industries' AIRS team, a leader in the design and manufacture of high-performance cooled infrared cameras and components. As the Production Supervisor, Micro-electronics, you will lead and empower a team of skilled technicians in the production of cutting-edge electronic components, directly contributing to the expansion of Anduril's advanced sensing systems. Note: Working hours for this position are second shift. Approximate working hours are 3-4PM start time to 11PM to Midnight end time.  WHAT YOU'LL DO Team Leadership & Development: Lead, mentor, and motivate a team of Micro-electronics Technicians. Conduct performance reviews, identify training needs, and develop individual skill sets to enhance overall team capability and efficiency. Production Oversight & Execution: Oversee and guide the team's execution of complex wire bonding operations and microelectronic assembly. Provide expert technical guidance on precise gold ball, wedge, ribbon, alloy, and manganin wire bonding (e.g., 0.001" diameter) onto various substrates, and the meticulous integration of micro-electronic components using specialized adhesives and epoxies. Process Adherence & Optimization: Ensure strict adherence to detailed build sheets, Interface Control Documents (ICDs), and engineering drawings. Proactively identify opportunities for process optimization, implement improvements, and develop best practices to enhance throughput, quality, and cost-effectiveness. Equipment Management & Calibration: Manage and oversee the setup, calibration, minor adjustments, and routine preventative maintenance of various wire bonding machinery (manual, semi-automatic, automated, e.g., Westbond). Drive the optimization of parameters such as loop heights to achieve superior bond quality and efficiency. Quality Assurance Leadership: Establish and enforce robust in-process and final inspection protocols. Train and certify team members on quality standards and the effective use of measurement equipment (e.g., reticle, indicator, microscope, bond puller). Drive root cause analysis for any quality deviations and implement corrective and preventative actions. Technical Troubleshooting & Collaboration: Serve as the primary technical escalation point for the team. Lead the identification, analysis, and resolution of complex technical problems encountered during production. Foster strong, collaborative relationships with engineering, quality, and supply chain teams to drive continuous improvement and resolve cross-functional issues. Production Standards & Compliance: Enforce and continuously improve production standards for quality, consistency, and work rate. Ensure strict adherence to all cleanroom protocols, safety guidelines, and ESD procedures, promoting a safe, compliant, and efficient work environment. Resource Management & Reporting: Plan and allocate personnel, equipment, and materials to meet production schedules and targets. Track key performance indicators (KPIs) and report on production progress, issues, and successes to management. REQUIRED QUALIFICATIONS: High School Diploma or equivalent; Associate's or Bachelor's degree in a relevant technical field (e.g., Electronics, Manufacturing, Engineering Technology) preferred. Minimum of 5+ years of hands-on technical experience in microelectronic assembly or wire bonding, with at least 2+ years in a lead or supervisory role within a manufacturing environment. Advanced proficiency in various wire bonding techniques (manual gold ball, wedge, ribbon; semi-automatic; automated) and intricate microelectronic assembly, including precise adhesive and epoxy application. Demonstrated ability to lead, mentor, and develop a technical team, fostering a positive and productive work environment. Exceptional ability to read, interpret, and enforce detailed technical documentation (build sheets, ICDs, engineering drawings), and to train others on their proper application. Commitment to maintaining and enforcing a clean, safe, and ESD-compliant work environment. Must be a U.S. Person due to required access to U.S. export controlled information or facilities. US Salary Range $74,000 — $99,000 USD The salary range for this role is an estimate based