Advanced Packaging Technologist & Lead

Cerebras Systems builds the world's largest AI chip, 56 times larger than GPUs. Our novel wafer-scale architecture provides the AI compute power of dozens of GPUs on a single chip, with the programming simplicity of a single device. This approach allows Cerebras to deliver industry-leading training and inference speeds and empowers machine learning users to effortlessly run large-scale ML applications, without the hassle of managing hundreds of GPUs or TPUs.    Cerebras' current customers include top model labs, global enterprises, and cutting-edge AI-native startups.  OpenAI recently announced a multi-year partnership with Cerebras , to deploy 750 megawatts of scale, transforming key workloads with ultra high-speed inference.  Thanks to the groundbreaking wafer-scale architecture, Cerebras Inference offers the fastest Generative AI inference solution in the world, over 10 times faster than GPU-based hyperscale cloud inference services. This order of magnitude increase in speed is transforming the user experience of AI applications, unlocking real-time iteration and increasing intelligence via additional agentic computation. Advanced Packaging Technologist & Lead   We are seeking an accomplished  Advanced Packaging Technologist & Lead  to drive the development, integration, and deployment of next‑generation semiconductor packaging technologies. This role is critical in architecting and implementing advanced, high‑performance, and high‑density packaging solutions supporting cutting‑edge compute, AI, and heterogeneous integration platforms.   Key Responsibilities   Advanced Packaging Architecture & Development   Design and implement advanced semiconductor packaging technologies, including  2.5D/3D stacking, heterogeneous integration , high-bandwidth interconnects, and advanced power-delivery architectures.   Lead R&D in  Chip-on-Wafer (CoW)  and  Wafer-to-Wafer (W2W)  bonding approaches for high-density integration.   Develop and optimize solutions using  silicon interposers ,  Through-Silicon Vias (TSVs) , and  multi‑layer RDL packaging  to enable ultra‑high‑bandwidth and low‑latency connections.   Engineer advanced packaging structures using  low‑CTE substrates ,  FLEX interconnects , and  organic or ceramic substrate technologies .   Align internal architects and external partners to  deliver manufacturable designs  and  steer our strategic technology direction .   Leverage simulation-driven design to reduce hardware iteration cycles and ensure first-pass success in complex architectures.     Assembly, Materials, & Interconnect Technologies   Drive technology innovation in  advanced buildup substrates , including designs with and without embedded dies.   Oversee  flip-chip bonding  processes using both  solder balls  and  copper pillars .   Lead development of  substrate embedding  for silicon dies, capacitors, passives, and other active components.   Develop and refine  advanced dicing methodologies  (laser and mechanical saw) tailored for nanometer-class nodes.   Select materials ; solder alloys, underfills, thermal interface materials (TIMs), and other key materials that  enable high performance, manufacturability, and reliability     Process Technology & Reliability   Manage  package-level and board-level qualification , ensuring robust performance across thermal, mechanical, and electrical stress conditions   Lead analysis and improvements in  solder reliability , including temperature cycling, electromigration (EM), and stress modeling.   Oversee  ultra-thin die handling and processing  for fragile, high-performance devices.   Drive  backside metallization  and  RDL process development  to support advanced packaging roadmaps.   Lead  failure analysis  when a new design fails a stress test and  pivot the team toward a solution .       Qualifications   BS EE, MS EE or equivalent engineering discipline   10+ years of experience in advanced packaging   Highly preferred: working knowledge of simulation tools (i.e. Ansys, Cadence, Abaqus)    The base salary range for this position is $175,000 to $275,000 annually.  Actual compensation may include bonus and equity, and will be determined based on factors such as experience, skills, and qualifications.   Why Join Cerebras People who are serious about software make their own hardware. At Cerebras we have built a breakthrough architecture that is unlocking new opportunities for the AI industry. With dozens of model releases and rapid growth, we’ve reached an inflection  point in our business. Members of our team tell us there are five main reasons they joined Cerebras: Build a breakthrough AI platform beyond the constraints of the GPU. Publish and open source their cutting-edge AI research. Wo